陈辉明

【来源: | 发布日期:2020-04-28 】

名:陈辉明


别:

学位/职称:博士/高级实验师                         

出生年月:198605

联系方式:18879719865

电子邮箱:huizhichen01@163.com


办公地点:铜基新材料及加工研究所

学科专业:材料科学与工程、材料工程

讲授课程:连铸连轧

研究方向:铜合金、低温无铅焊料

出版著作及代表性论文:

1. Yunqing Zhu, Jinfa Liao, Huiming Chen*, Hang Wang, Bin Yang, Solidification microstructure of Cu-Cr and Cu-Cr-In alloys, Materials Research Express, 2020;

2. Huiming Chen, Dawei Yuan, Webin Xie, Jianbo Zhang, Hang Wang*, Bin Yang*, A novel route for strengthening copper rods: Non-solution heat treatment combined with pre-aging, Journal of Materials Processing Technology, 274, 116290, 2019;

3. Huiming Chen, Dawei Yuan, Shanjiang Wu, Hang Wang, Weibin Xie*, Bin Yang*, Relationship between microstructure and properties of Cu-Cr-Ag-(Ce) alloy using microscopic investigation, Scanning, 2017, 1-8, 2017;

4. Huiming Chen, Pengzhe Gao, Huaichao Peng, Haigen Wei, Weibin Xie, Hang Wang, Bin Yang*, Study on the hot deformation behabior and microstructure evolution of Cu-Cr-In alloy, Journal of Materials Engineering and Performance, 28, 2128-2136, 2019;

5. Huiming Chen, Jinfa Liao, Shanjiang Wu, Liukui Gong, Junfeng Wang, Hang Wang*, Effects of Dy substitution for Sn on the solderability and mechanical property of the standard near eutectic Sn-Ag-Cu alloyJournal of Materials Science: Materials in Electronice, 29, 12662-126682018;

6. Huiming Chen, Genfeng Shang, Wangyi Hu, Hang Wang*, Growth kinetics of intermetallic compounds during interfacial reactions between SnAgCuGa lead-free solder and Cu substrate, Powder Metallurgy and Metal Ceramics, 56(1-2), 108-112, 2017;

7. Huiming Chen, Chengjun Guo, Jiapeng Huang, Hang Wang*, Influence of gallium addition in Sn-Ag-Cu lead-free solder, Journal of Materials Science: Materials in Electronics, 26(7), 5459-5464, 2015.


主持承担科研项目及经费:

1. 国家重点研发计划,铜合金特种加工材组织演变与力学—功能特性调控机理,2016YFB0301401,参与,在研。

2. 江西省教育厅青年基金,多场耦合作用下无铅焊点界面反应及IMC生长行为研究,GJJ190479,主持,在研。

3. 赣州市科技局科技创新人才计划,中重稀土对无铅焊料组织性能及界面反应热力学动力学研究,主持,在研。


科研成果(获奖、专利、版权、著作权、外观设计等):

1. 陈辉明, 邬善江, 汪航, 李明茂, 杨斌. 一种复合强化高强高导铜合金及其制备方法. 中国: ZL201710164079.5[P], 20190416日。